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    Program

    The following is the technical program for the 70th ECTC, this year a Virtual Conference. To access the recorded presentations during June 3–30, 2020, please refer to your registration confirmation e-mail. Not registered yet? Register here to access the presentations for free.

    SPECIAL SESSIONS of the Virtual Event
    recorded presentations 

    Special Sessions
    Keynote Presentation: INNOVATIVE HETEROGENEOUS INTEGRATION TECHNOLOGIES INITIATE A NEW SEMICONDUCTOR ERA - Douglas Yu – Taiwan Semiconductor Manufacturing Company (TSMC)
    Session: Bridge to quantum Computing
    Session: Cutting-Edge Technology on Integrated Photonics and Packaging
    Session: Diversity and Inclusion Drives Innovation and Productivity
    Session: 3DIC - Past, Present and Future
    Session: Future Semiconductor Packages For Artificial Intelligence Hardware
    Session: Heterogeneous Integration Roadmap Workshop
    Session: Presentations from our Conference Sponsors

    More Information on all Special Sessions of the Virtual Event

    TECHNICAL SESSIONS of the Virtual Event
    recorded presentations

    Packaging Technologies
    Session 1: Fan-Out Technologies for System Integration
    Session 7: Advances in Packaging at the Wafer/Panel Level
    Session 10: MEMS and Sensors
    Session 13: 2.5D and 3D Technology Enabling High Performance Computing
    Session 19: Embedded and Heterogeneous Integration
    Session 25: High Density Fan-Out Technology
    Session 31: Automotive and Power Electronics Packaging
    High-Speed, Wireless & Components
    Session 3: Antenna-in-Package for 5G and Radar Systems
    Session 9: Power Delivery and Conversion
    Session 21: High Speed in Signal Integrity
    Session 30: RF and Power Components and Modules
    Emerging Technologies
    Session 18: Emerging Flexible Hybrid Electronics
    Session 22: Advanced Biosensors and Bioelectronics
    Session 35: Additive Manufacturing and Innovative Materials for Packaging
    Interconnections
    Session 8: High-Density RDL for Advanced Interconnects
    Session 16: Sintering and Interconnect Reliability
    Session 26: Breakthroughs in TSV and TGV Technologies
    Session 32: Stacking and Bonding Technologies
    Assembly & Manufacturing Technology
    Session 5: Advanced Bonding Methods and Processing
    Session 7: Advances in Packaging at the Wafer/Panel Level
    Session 15: Flexible and Printed Electronics
    Session 23: Advanced Dicing and Laser-Assisted Bonding
    Session 28: Enhanced Manufacturing and Process Integration
    Materials & Processing
    Session 2: Innovation on WLCSP and 3D Packaging
    Session 14: Materials for High-Speed/Frequency and 5G
    Session 20: Materials and Processes for FOWLP and PLP
    Session 29: Advances in Bonding Materials and Processes
    Session 34: Emerging Materials and Processing
    Thermal/Mechanical Simulation & Characterization
    Session 6: Interconnect Modeling
    Session 12: Modeling for Heterogeneous Integration: From Wafer to Board Level
    Session 24: Material and Interface Modeling
    Session 36: Multiphysics and AI-Enhanced Modeling Approaches
    Photonics
    Session 4: Advanced Photonic Integration Packaging
    Applied Reliability
    Session 11: Reliability of Next-Generation Interconnects
    Session 17: Automotive and Harsh Environment Reliability
    Session 27: WLP and Advanced Technology Reliability
    Session 33: Advances in Reliability Assessment
    Topical Sessions Hosted by Interactive Presentations Technical Subcommittee
    Session 37: New Methods, Techniques and Devices in Packaging
    Session 38: 5G, mm-wave and RF Packaging
    Session 39: Current Trends in High Speed Interconnects
    Session 40: Manufacturing Techniques for Advanced Packaging
    Session 41: Characterization and Analysis of Packaging Materials
    Session 42: Thermo-Mechanical Effects in Packaging
    Session 43: Reliability and Failure Analyses of Emerging Materials
    Session 44: Optoelectronics, Flex and Emerging Techniques
    Session 45: Student Session

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